Abstract CTE mismatch between direct bonding copper (DBC) layers results in excessive thermal stress, causing the fatigue cracks and delamination after long time run, which deteriorate the reliability of DBC and the power module in the end. A method of designing mesh patterns on DBC is proposed in this paper to release the thermal stress. At the same time, the comprehensive analysis of the relationship between the mesh patterns and the DBC reliability is made. The finite element method is used to simulate the distributions and variations of thermal stress on DBC with different mesh patterns. Both the theoretical and experimental results prove the function of the thermal stress release for the mesh on DBC. Furthermore, the meshes on the edge or corner, and with smaller size are most effective. In experiment, compared with the DBC without mesh, the thermal cycling lifetime for the DBC with the optimized mesh pattern could be improved by 15 times.

中文翻译：

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网格模式对 DBC 热循环可靠性影响的建模与分析

摘要 直接键合铜（DBC）层之间的CTE不匹配导致热应力过大，长时间运行后导致疲劳裂纹和分层，从而降低DBC和最终功率模块的可靠性。本文提出了一种在 DBC 上设计网格图案以释放热应力的方法。同时，综合分析了网格模式与DBC可靠性之间的关系。有限元方法用于模拟不同网格模式下DBC上热应力的分布和变化。理论和实验结果都证明了 DBC 上网格的热应力释放功能。此外，边缘或角落上的网格以及尺寸较小的网格最有效。在实验中，与无网格的 DBC 相比，