Micromachining of brittle materials like monocrystalline silicon to obtain deterministic surface topography is a 21st Century challenge. As the scale of machining has shrunk down to sub-micrometre dimensions, the undulations in the machined topography start to overlap with the extent of elastic recovery (spring back) of the workpiece, posing challenges in the accurate estimation of the material's elastic recovery effect. The quantification of elastic recovery is rather complex in the grinding operation due to (i) randomness in the engagement of various grit sizes with the workpiece as well as (ii) the high strain rate employed during grinding as opposed to single grit scratch tests employed in the past at low strain rates. Here in this work, a method employing inclination of workpiece surface was proposed to quantify elastic recovery of silicon in ultra-fine rotational grinding. The method uniquely enables experimental extraction of the elastic recovery and tip radius of the grits actively engaged with the workpiece at the end of the ultra-fine grinding operation. The proposed experimental method paves the way to enable a number of experimental and simulation endeavours to develop more accurate material constitutive models and grinding models targeted towards precision processing of materials. It can also be shown that using this method if the tip radius distribution of active grits is measured at different time instances, then this data can be used to assess the state of the grinding wheel to monitor its wear rate which will be a useful testbed to create a digital twin in the general framework of digital manufacturing processes.

微加工脆性材料（如单晶硅）以获得确定的表面形貌是21世纪的挑战。随着加工规模缩小到亚微米级，加工后的形貌中的起伏开始与工件的弹性回复（回弹）程度重叠，从而在准确估算材料的弹性回复效果方面带来了挑战。弹性恢复的量化在磨削操作中非常复杂，这是由于（i）各种粒度的磨料与工件啮合的随机性，以及（ii）磨削过程中采用的高应变速率，而不是单粒度的刮擦测试。低应变率的过去。在这项工作中 提出了一种利用工件表面倾斜度的方法来量化超细旋转磨削中硅的弹性回复率。该方法独特地使得能够在超细磨削操作结束时通过实验提取主动与工件接合的砂砾的弹性回复率和尖端半径。所提出的实验方法为实现许多实验和模拟努力铺平了道路，以开发更精确的材料本构模型和针对材料精密加工的研磨模型。还可以证明，如果在不同的时间点测量了活性砂的尖端半径分布，则使用此方法，