Abstract Ammonia (NH3) is widely used in semiconductor fabrication as an indispensable chemical substance in chemical mechanical planarization (CMP), etching and cleaning processes. The undesired outgassing of residual NH3 gas results in many severe defects on integrated circuits. The front opening unified pods (FOUPs), which are made of polymers, were introduced as a controlled-microenvironment to protect the processed wafers during transport and storage steps. However, the FOUPs potentially outgas the previous sorbed-NH3 to FOUPs' atmosphere, leading to NH3 cross-contamination. The development of NH3-free liquid phase extraction (LPE) set-up coupled to ionic chromatography (IC) analysis allows sensitive NH3 measurement on wafer surfaces in avoiding the artifacts of airborne NH3 from cleanroom environment. The adsorption and desorption kinetics of NH3 on Cr-coated surface have been determined in cleanroom conditions (21 ± 2°C, 1.0 atm, different NH3 gas concentration (10–35 ppbv) and relative humidity (

中文翻译：

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空气中氨在洁净室镀铬晶片上的吸附和解吸动力学取决于湿度和 NH3 浓度

摘要 氨（NH3）作为化学机械平坦化（CMP）、蚀刻和清洗工艺中不可缺少的化学物质，被广泛应用于半导体制造中。残留NH3气体的不希望的脱气导致集成电路上的许多严重缺陷。由聚合物制成的前开口统一吊舱 (FOUP) 被引入作为受控微环境，以在运输和存储步骤中保护处理过的晶圆。然而，FOUP 可能会将先前吸附的 NH3 释放到 FOUP 的大气中，从而导致 NH3 交叉污染。与离子色谱 (IC) 分析相结合的无 NH3 液相萃取 (LPE) 装置的开发允许在晶片表面上进行灵敏的 NH3 测量，从而避免来自洁净室环境的空气中 NH3 的伪影。