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Microstructure and mechanical properties of hot rolled ODS copper
Nuclear Materials and Energy ( IF 2.3 ) Pub Date : 2020-05-16 , DOI: 10.1016/j.nme.2020.100754
A. Muñoz , B. Savoini , M.A. Monge , M. Eddahbi , O.J. Dura

Dispersion strengthened copper alloys have been produced by following a powder metallurgy route that have consisted of milling copper and yttrium acetate powders in a planetary ball milling and subsequently sintering by hot isostatic pressing (HIP). In order to increase the degree of densification of the materials, they were subjected to a thermal treatment in vacuum and to a hot rolling process at 1173 K. The decomposition of the yttrium acetate during the thermal treatments resulted in the formation of voids, with a loss of densification that could not be satisfactorily improved with the hot rolling processing. The microstructure and the mechanical and thermal properties of the alloys were analyzed by scanning electron microscopy, electron backscattering diffraction, micro and nanohardness measurements, and compression tests and thermal conductivity measurements, both in the range 300–780 K. The best mechanical properties were obtained for the as-HIP material, with a mean grain size of 0.3 ± 0.3 μm and a yield strength value at room temperature of 520 MPa. In contrast, the material with the highest thermal conductivity for the entire range of temperature was found to be the alloy thermal treated in vacuum at 1273 K and later subjected to the hot rolling processing. The different microstructural characteristics of the alloys such as grain size, defects present in the grains and size of voids seems to be responsible of the differences on their thermal conductivity values.



中文翻译:

热轧ODS铜的组织和力学性能

弥散强化的铜合金是通过粉末冶金路线生产的,该路线包括在行星式球磨机中研磨铜粉和醋酸钇粉,然后通过热等静压(HIP)进行烧结。为了增加材料的致密化程度,将它们在真空中进行热处理,并在1173 K的温度下进行热轧工艺。热处理期间乙酸钇的分解导致形成空隙,并形成气泡。热轧工艺无法令人满意地改善致密化损失。通过扫描电子显微镜,电子反向散射衍射,显微和纳米硬度测量,分析了合金的微观结构以及力学和热学性能。以及压缩测试和热导率测量,都在300–780 K范围内。as-HIP材料获得了最佳的机械性能,平均晶粒尺寸为0.3±0.3μm,室温下的屈服强度值为520 MPa。相反,发现在整个温度范围内具有最高导热率的材料是在真空中于1273 K热处理并随后进行热轧处理的合金。合金的不同微观结构特征,例如晶粒尺寸,晶粒中存在的缺陷和空隙的尺寸,似乎是造成其导热系数差异的原因。3μm,室温下的屈服强度值为520 MPa。相反,发现在整个温度范围内具有最高导热率的材料是在真空中于1273 K热处理并随后进行热轧处理的合金。合金的不同微观结构特征,例如晶粒尺寸,晶粒中存在的缺陷和空隙的尺寸,似乎是造成其导热系数差异的原因。3μm,室温下的屈服强度值为520 MPa。相反,发现在整个温度范围内具有最高导热率的材料是在真空中于1273 K热处理并随后进行热轧处理的合金。合金的不同微观结构特征,例如晶粒尺寸,晶粒中存在的缺陷和空隙的尺寸,似乎是造成其导热系数差异的原因。

更新日期:2020-05-16
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