In order to improve the grinding wheel wear during the sapphire steep aspheric surface grinding process, a SiC-reinforced resin-bonded hemispherical diamond wheel was used and the arc envelope grinding performance was investigated. Firstly, the mapping relationship between the contours of the grinding wheel and the aspheric surface was established based on the grinding conditions. The wear of the hemispherical diamond wheel was modelled, and the result indicates that the maximum wear occurred at the edge of the hemisphere, decreases along the generatrix and increases near the center. Then, the form-trued diamond wheel was used for grinding the sapphire steep aspheric surface. The concave and convex surface form error obtained at the central part of Φ 50 mm are 2.5 μm and 1.3 μm, respectively. The surface roughness R_a is 230–450 nm, which is affected by the material removal rate and the sapphire crystal anisotropy. The SiC-reinforced resin-bonded diamond wheel possesses favorable self-sharpening ability and sufficient diamond grain retention capacity for sapphire grinding. The wear distribution shows that the most severe wear parts of the grinding wheel are at the edge and the center of the grinding zone, which is consistent with the model-predicted results.

为了改善蓝宝石陡峭非球面磨削过程中的砂轮磨损，使用了SiC增强树脂结合的半球形金刚石砂轮，并研究了弧面磨削性能。首先，根据磨削条件建立了砂轮轮廓与非球面的映射关系。对半球形金刚石砂轮的磨损进行了建模，结果表明最大磨损发生在半球的边缘，沿母线减小，而在中心附近增大。然后，将成型的金刚石砂轮用于磨削蓝宝石陡峭的非球面。在Φ50 mm的中心部分获得的凹凸表面形成误差分别为2.5μm和1.3μm。表面粗糙度R_a为230–450 nm，这受材料去除速率和蓝宝石晶体各向异性的影响。SiC增强树脂粘结金刚石砂轮具有良好的自锐能力和足够的金刚石晶粒保持能力，可用于蓝宝石磨削。磨损分布表明，砂轮最严重的磨损部分位于磨削区域的边缘和中心，这与模型预测的结果一致。