In this paper, the emerging role of ionic species in plasma assisted chemical deposition processes is discussed in detail for commemorating the Career of John Coburn, who studied the role of ionic species in plasma etching processes forty years ago. It is shown that, in both plasma enhanced chemical vapor deposition and plasma enhanced atomic layer deposition processes, plasma ions can play a major role in tuning a wide range of physical properties of thin films. In both processes, the possibility of extracting plasma ions with a tunable incident kinetic energy driven on the substrate surface is shown to provide a valuable additional degree of freedom in plasma processing. While a too large incident kinetic energy of plasma ions may have damaging effects linked to surface sputtering and atomic peening, a relatively low energy ion bombardment ensures a substantial improvement of thin film purity and the effective tuning of their microstructural properties. This phenomenon is attributed to the synergetic effect boosting momentum transfer and chemical reactivity among radicals and ionic plasma species, which, in turn, modulates plasma-surface interactions. Taking advantage of these tunable physical properties opens up the way to a large array of pathways for selective deposition processes in both 2D and 3D nanoscale microstructures.

中文翻译：

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等离子体沉积-离子对等离子体增强的化学气相沉积，等离子体增强的原子层沉积及其在区域选择性沉积中的应用的影响

在本文中，为纪念John Coburn的职业，详细讨论了离子物质在等离子体辅助化学沉积过程中的新兴作用，他的职业生涯研究了40年前在离子蚀刻过程中离子物质的作用。结果表明，在等离子体增强的化学气相沉积和等离子体增强的原子层沉积过程中，等离子体离子在调节薄膜的各种物理性质中都可以发挥主要作用。在这两个过程中，都显示出提取具有在基板表面上驱动的可调入射动能的等离子体离子的可能性，从而为等离子体处理提供了宝贵的附加自由度。等离子体离子的入射动能过大时，可能会产生与表面溅射和原子喷丸有关的破坏性影响，相对较低的能量离子轰击可确保大大提高薄膜的纯度并有效调节其微结构性能。这种现象归因于协同效应，促进了自由基和离子等离子体物质之间的动量转移和化学反应，进而调节了等离子体与表面的相互作用。利用这些可调节的物理特性为2D和3D纳米级微观结构中的选择性沉积过程打开了通往众多途径的道路。