Phthalonitrile resin/exfoliated hexagonal boron nitride (h-BN) composites with high thermal conductivity were fabricated using a novel approach. The route included two steps, micro-h-BN was coated and dispersed by phthalonitrile monomers via the function of heterogeneous nucleation, and then micro-h-BN was exfoliated by heat release during the phthalonitrile curing process. The composites achieved a high thermal conductivity of 0.736W (m·K)−1 containing 20 wt% micro-h-BN, which is 3.17 times higher than that of pure phthalonitrile resin at 0.232W (m·K)−1. Compared to traditional routes, the novel preparation approach requires less BN fillers when improving the same thermal conductivity. Importantly, other thermosetting polymers can also encapsulate BN through this strategy, which paves a new way for preparing thermally conductive thermosetting polymer–matrix composites.

中文翻译：

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邻苯二甲腈树脂/六方氮化硼复合材料的原位制备及性能

使用一种新方法制备了具有高导热率的邻苯腈树脂/剥离六方氮化硼 (h-BN) 复合材料。该路线包括两个步骤，即在邻苯二甲腈单体通过异相成核作用包覆和分散micro-h-BN，然后在邻苯二甲腈固化过程中通过放热剥离micro-h-BN。该复合材料在含有 20 wt% micro-h-BN 的情况下实现了 0.736W (m·K)-1 的高导热系数，比纯邻苯二甲腈树脂在 0.232W (m·K)-1 时的导热系数高 3.17 倍。与传统路线相比，新的制备方法在提高相同热导率的情况下需要更少的 BN 填料。重要的是，其他热固性聚合物也可以通过这种策略封装 BN，