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Fluid Flow and Heat Transfer Studies on a Discretely and Differently Heated Electronic Board
Journal of Engineering Thermophysics ( IF 2.4 ) Pub Date : 2020-02-17 , DOI: 10.1134/s1810232820010075
Y. Muralikrishna , C. Gururaja Rao

Abstract

The article presents the results of a comprehensive fundamental numerical study of the problem of conjugate mixed convection with surface radiation from a vertical electronic board with multiple different discrete heat sources. The governing equations for the fluid flow and heat transfer, which are considered in their full strength, are transformed from a primitive variable form to a stream-function-vorticity formulation and are subsequently normalized. The equations thus obtained are converted into an algebraic form using the finite volume method. The governing equations for the temperature distribution along the board were deduced from the appropriate energy balance between various energy interactions the board is engaged in. These equations are solved by the Gauss–Siedel iterative technique. The cooling medium is air, which is assumed to be radiation transparent. The computer code was specially written. The effects of the fluid flow velocity, material properties, and surface properties on the thermal behavior of the board are studied. The dependence of the pumping power on the surface emissivity of the board in different mixed convection regimes and for different materials was probed into. The singular role exhibited by buoyancy in the present problem is elucidated.


中文翻译:

离散和不同加热的电子板上的流体流动和传热研究

摘要

本文介绍了对来自具有多个不同离散热源的垂直电子板的表面辐射进行共轭混合对流与表面辐射问题的综合基础数值研究的结果。充分考虑了流体流动和传热的控制方程,将其从原始变量形式转换为流函数涡度公式,然后进行归一化。使用有限体积法将由此获得的方程式转换为代数形式。电路板沿温度分布的控制方程式是从电路板所参与的各种能量相互作用之间的适当能量平衡推导出来的。这些方程式通过高斯-西德尔迭代技术求解。冷却介质是空气,假定是辐射透明的。计算机代码是专门编写的。研究了流体流速,材料特性和表面特性对板热性能的影响。探讨了在不同的混合对流方式和不同材料下,泵浦功率对板表面发射率的依赖性。阐明了浮力在当前问题中表现出的独特作用。
更新日期:2020-02-17
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