ABSTRACT The diffusion bonding of conventional alloy Ti–6Al–4V (Ti-64) and composites of this alloy with 10% of TiC or TiB fabricated using blended elemental powder metallurgy was successfully carried out at 850–1000°C, with a holding time of 60 min under 0.7–1.5 MPa pressure. The metallographic and electron backscattered diffraction studies as well as the bending and microhardness tests across the bonds are presented as the evidence of joint integrity. The selected experimental parameters do not cause undesirable structural changes (degradation) in the base metals adjacent to the bond interface. Particle reinforcement at ∼10% did not appear to modify bonding parameters when compared to the unreinforced Ti-64 alloy.

中文翻译：

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TiC或TiB增强Ti-6Al-4V基复合材料与传统Ti-6Al-4V合金的扩散结合

摘要 传统合金 Ti-6Al-4V (Ti-64) 和该合金与 10% TiC 或 TiB 使用混合元素粉末冶金制造的复合材料在 850-1000°C 下成功地进行了扩散结合，保持时间在 0.7-1.5 MPa 压力下持续 60 分钟。金相学和电子背散射衍射研究以及结合处的弯曲和显微硬度测试作为接头完整性的证据。选定的实验参数不会在与键合界面相邻的基础金属中引起不希望的结构变化（降解）。与未增强的 Ti-64 合金相比，约 10% 的粒子增强似乎不会改变结合参数。