ABSTRACT This study proposes the use of a Si–Mg composite filler for low-temperature joining of alumina (Al2O3) ceramics while maintaining a high-temperature reliability. The Al2O3/Al2O3 joints were formed at 1100°C in vacuum by Si-layer formation at the joint interface; the molten Si–Mg liquid phase was transformed into a solid Si layer by Mg-evaporation-induced isothermal solidification. The joint tensile strength at room temperature was as high as 20–30 MPa on average when the initial Mg contents in the filler ranged from 43 to 53 at.-%. Such joints were examined by bending tests at 1200°C in air with a fracture stress of ∼65 MPa, which revealed their potential to be provided for use at least 100°C above the bonding temperature.

中文翻译：

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用于高温应用的硅镁复合填料连接氧化铝陶瓷

摘要 本研究提出使用 Si-Mg 复合填料用于氧化铝 (Al2O3) 陶瓷的低温接合，同时保持高温可靠性。Al2O3/Al2O3 接头是在 1100°C 真空条件下通过在接头界面形成 Si 层而形成的；熔融的硅镁液相通过镁蒸发诱导等温凝固转变为固体硅层。当填料中初始 Mg 含量为 43 至 53 at.-% 时，室温下的接头拉伸强度平均高达 20-30 MPa。通过在空气中 1200°C 和约 65 MPa 的断裂应力下通过弯曲试验对此类接头进行了检查，这表明它们有可能在高于粘合温度 100°C 的温度下使用。