Abstract Epoxy-based isotropic conductive adhesives (ICA) have become the dominant materials in the microelectronic packaging field due to their advantages of low technological temperature, ultrafine line printing, and easy interconnection. During the service of electronic products, the ICA joints are subjected to shear loads induced by mechanical mismatch between packaging chip and substrate. In this work, the joint specimens with different contents of silver flakes (50 wt% and 70 wt%) prepared using pure copper plate adherend in the form of single-lap were used for the tensile–shear tests under different loading rates. The relationship between shear stress and location of the adhesive layer was theoretically derived. The interface fracture energy, shear strength, and fracture displacement of ICA, as well as concentration of shear stress in the adhesive layer, increase with the increase in loading rate. The shear stress concentration is relatively greater for the ICA with higher content of silver flakes.

中文翻译：

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不同银含量导电胶剪切力学性能的加载速率响应

摘要 环氧类各向同性导电胶（ICA）以其工艺温度低、印刷超细、易互连等优点成为微电子封装领域的主导材料。在电子产品的使用过程中，ICA 接头会受到封装芯片和基板之间机械失配引起的剪切载荷。在这项工作中，使用单搭接形式的纯铜板被粘物制备的具有不同银片含量（50 wt% 和 70 wt%）的接头试样用于不同加载速率下的拉伸剪切试验。理论上推导出了剪切应力与粘合剂层位置之间的关系。ICA的界面断裂能、剪切强度和断裂位移，以及粘合剂层中剪切应力的集中，随着加载速率的增加而增加。对于银片含量较高的 ICA，剪切应力集中相对较大。