A model was established for four-element material with HCP structure by EET. The filler of TiZrCuNi was analyzed by the model. It was found that Ni element is beneficial for the strength of the filler but Cu element is beneficial for the ductility of the filler. It showed that controlling the amount of Cu and Ni with the proper distribution of them was important. Compared with the filler Ti-13Zr-22Cu-9Ni wt%, the designed Ti-(10~11)Zr-(10~12)Cu-(9~10)Ni wt% with lowering the amount of Cu and Ni to 19 wt% also has strong strength and good ductility. The TA15 joint by vacuum brazing was conducted with the designed filler metal—Ti-(10~11)Zr-(10~12)Cu-(9~10)Ni wt%. The interface without IMC was achieved and the homogeneous Widmanstätten microstructure was attributed to the high strength of the joints. And all the fracture occurred in the base.

中文翻译：

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TA15合金的钛基钎料与真空钎焊的模拟。

通过EET建立了具有HCP结构的四元素材料模型。通过该模型分析了TiZrCuNi的填充物。已经发现，Ni元素有利于填料的强度，而Cu元素有利于填料的延展性。结果表明，适当地控制铜和镍的含量很重要。与填料Ti-13Zr-22Cu-9Ni wt％相比，设计的Ti-（10〜11）Zr-（10〜12）Cu-（9〜10）Ni wt％将Cu和Ni的含量降至19 wt％还具有强的强度和良好的延展性。通过设计的填充金属Ti-（10〜11）Zr-（10〜12）Cu-（9〜10）Ni wt％进行真空钎焊TA15接头。实现了没有IMC的界面，均匀的Widmanstätten微观结构归因于接头的高强度。并且所有的断裂都发生在基部。