The flexible laser micromilling technology for ceramic MEMS production of microhotplates in the surface mount device (SMD) package is described. Current results demonstrate that using described technology makes it possible to manufacture all parts of MEMS sensor in the SMD with form factor of SOT-23 package type.

中文翻译：

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激光微铣削技术是快速陶瓷MEMS器件的关键

描述了用于表面贴装器件（SMD）封装中的微热板的陶瓷MEMS生产的柔性激光微铣削技术。当前结果表明，使用所述技术可以在SMD中以SOT-23封装类型制造MEMS传感器的所有零件。