With their capacity for real time monitoring and spatial mapping, implantable sensors are becoming an increasingly important aspect of next generation precision healthcare. Microfabricated sensor systems are a popular choice, owing to their capacity for miniaturisation, repeatable mass manufacture, and numerous pre-existing sensor archetypes. Despite the drive for development, packaging these sensors for the environment within the body, as well as the implantation process itself, presents a significant challenge. This paper presents microelectronic test structures, which can be used to assess, compare, and optimise implantable packaging solutions in a standardised manner. The proposed structures are used to investigate: (i) the capacity of the material to be patterned, (ii) the permeability of the insulation material, (iii) adhesion of the encapsulant to the die, and (iv) the physical robustness of the package to implantation through a needle. They are used to characterise an example packaging strategy, using biocompatible epoxy-resin. In addition, a method of optimising the packaging performance using the test structures is presented.

中文翻译：

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用于开发植入式传感器封装的测试结构

凭借其实时监控和空间映射的能力，可植入传感器正成为下一代精准医疗保健的一个越来越重要的方面。微制造传感器系统是一种流行的选择，因为它们具有小型化、可重复的大规模制造能力和众多预先存在的传感器原型。尽管有发展动力，但为体内环境以及植入过程本身包装这些传感器仍然是一项重大挑战。本文介绍了微电子测试结构，可用于以标准化方式评估、比较和优化植入式封装解决方案。所提出的结构用于研究：(i) 被图案化材料的能力，(ii) 绝缘材料的渗透性，(iii) 密封剂与管芯的粘附，以及 (iv) 封装对通过针植入的物理强度。它们用于描述使用生物相容性环氧树脂的示例包装策略。此外，还介绍了一种使用测试结构优化封装性能的方法。