AN unintended error has occurred in the processing of the August 1998 issue of IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY — PART A: ADVANCED PACKAGING. This issue includes eight technical articles from the IEEE 6th Topical Meeting on the Electrical Performance of Electronic Packaging, EPEP'97, October 27–29, 1997, San Jose, CA. However, the origin of these articles is not recognized in the August issue. In order to remedy this error, the titles and authors of these articles are reprinted here together with the foreword for the special section and the biographies of the Guest Editors. The editorial office sincerely apologizes to the Guest Editors, Reviewers, and Authors of these articles.

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编者的话

在1998年8月发行的有关组件，包装和制造技术的IEEE事务-部分A：高级包装中，发生了意外错误。本期杂志包括1997年10月27日至29日在加利福尼亚州圣何塞举行的IEEE第6届电子封装电气性能专题会议上的八篇技术文章。但是，这些文章的来历在八月号中并未得到认可。为了纠正此错误，此处重印了这些文章的标题和作者，以及特别版的序言和《客座编辑》的传记。编辑部向这些文章的客座编辑，审稿人和作者致以诚挚的歉意。