THE preceding list of eight papers have been selected from the 60 papers presented at the 6th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP'97, which was held in San Jose, CA, on October 27–29, 1997. Attendance was up 20% compared to the previous year which is a strong indication of the growing concern with electrical performance issues. The meeting had a truly international participation with presenters and attendees from Korea, Japan, Germany, Belgium, Spain, Austria, and Hungary. The technical sessions addressed the latest developments in power distribution, modeling of noise sources in package structures and interconnects, characterization techniques for both digital and microwave applications, and accelerated modeling and simulation methods. Very good presentations were given by participants from both industry and universities. Six invited talks from IBM, SUN, and Vienna University of Technology were spread over the three days.

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第六届电子包装电气性能专题会议的前言

前面的八篇论文是从1997年10月27日至29日在加利福尼亚州圣何塞举行的第6届IEEE电子封装电气性能电子专题会议上发表的60篇论文中选出的。与去年相比增长了20％，这充分表明人们日益关注电气性能问题。这次会议真正吸引了来自韩国，日本，德国，比利时，西班牙，奥地利和匈牙利的演讲者和与会人员的国际参与。技术会议讨论了功率分配，封装结构和互连中的噪声源建模，数字和微波应用的表征技术以及加速的建模和仿真方法的最新发展。来自行业和大学的参与者都作了非常好的介绍。在三天的时间里，IBM，SUN和维也纳科技大学举行了六次邀请演讲。