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Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
Communications Materials ( IF 7.5 ) Pub Date : 2020-05-05 , DOI: 10.1038/s43246-020-0024-3
B. Chad Hornbuckle , Cyril L. Williams , Steven W. Dean , Xuyang Zhou , Chaitanya Kale , Scott A. Turnage , John D. Clayton , Gregory B. Thompson , Anit K. Giri , Kiran N. Solanki , Kristopher A. Darling

The microstructures of materials typically undergo significant changes during shock loading, causing failure when higher shock pressures are reached. However, preservation of microstructural and mechanical integrity during shock loading are essential in situations such as space travel, nuclear energy, protection systems, extreme geological events, and transportation. Here, we report ex situ shock behavior of a chemically optimized and microstructurally stable, bulk nanocrystalline copper–tantalum alloy that shows a relatively unchanged microstructure or properties when shock compressed up to 15 GPa. The absence of shock-hardening indicates that the grains and grain boundaries that make up the stabilized nanocrystalline microstructure act as stable sinks, thereby annihilating deformation-induced defects during shock loading. This study helps to advance the possibility of developing advanced structural materials for extreme applications where shock loading occurs.



中文翻译:

纳米铜-钽合金在冲击载荷下的稳定显微组织

材料的微观结构通常在冲击载荷过程中发生重大变化,当达到更高的冲击压力时会导致失效。但是,在太空旅行,核能,保护系统,极端地质事件和运输等情况下,在冲击载荷期间保持微观结构和机械完整性至关重要。在这里,我们报告了一种化学优化且微结构稳定的块状纳米晶铜-钽合金的异位冲击行为,当冲击压缩到15 GPa时,其表现出相对不变的微观结构或性能。缺少冲击硬化表明构成稳定的纳米晶体微结构的晶粒和晶界充当稳定的凹陷,从而消除了冲击载荷过程中由变形引起的缺陷。

更新日期:2020-05-05
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