In micro electrochemical machining (ECM), stray corrosion always causes undesired material dissolution and deteriorates the machining localization. Adopting sidewall insulating films on the electrode is proven to be an effective approach for reducing stray corrosion. Sidewall films with characteristics of good insulation, thin thickness, and excellent durability are required. In previous work, we proposed a heavily-doped silicon electrode, on which silicon-based films were prepared and acted as the insulating films. To fabricate silicon electrodes, this research investigates wet etching behavior of heavily doped Si (100) and then presents a fabrication process. Firstly, shapes of micro electrodes are designed on photomasks of lithography. Aiming at patterned profiles, effects of etchants on etch rate, dimension accuracy and surface integrity are investigated. Experimental results indicate that tetramethylammonium hydroxide (TMAH) leads to smoother electrode surfaces and fewer de...

中文翻译：

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用于微电化学加工的硅电极的制造

在微电化学加工（ECM）中，杂散腐蚀始终会导致不希望的材料溶解，并使加工定位变差。事实证明，在电极上采用侧壁绝缘膜是减少杂散腐蚀的有效方法。需要具有良好的绝缘性，薄的厚度和优异的耐久性的特性的侧壁膜。在先前的工作中，我们提出了一种重掺杂硅电极，在其上制备了硅基膜并充当绝缘膜。为了制造硅电极，本研究调查了重掺杂Si（100）的湿法刻蚀行为，然后提出了制造工艺。首先，在光刻的光掩模上设计微电极的形状。针对图案轮廓，蚀刻剂对蚀刻速率的影响，研究了尺寸精度和表面完整性。实验结果表明，氢氧化四甲基铵（TMAH）可使电极表面更光滑，并减少电极表面的氧化。