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Simulation of subcooled flow boiling in manifold microchannel heat sink
Numerical Heat Transfer, Part A: Applications ( IF 2.8 ) Pub Date : 2020-04-07 , DOI: 10.1080/10407782.2020.1746578
Yang Luo 1 , Wei Li 1
Affiliation  

Abstract The manifold microchannel (MMC) heat sink has become the most popular one among emerging technologies for high heat flux thermal management because of its high surface-to-volume ratio. Even though numerous numerical studies have been performed for the single-phase flow in the MMC heat sink, researches on two-phase flow boiling/condensation in this type of microchannel is seldomly reported because of its issues with flow pattern prediction. In the present work, a numerical approach involving two-phase interface capturing, phase change and solid heat conduction is conducted for the simplified MMC unit cell model. Heat and mass transfers of Lee model and interfacial heat resistance model for phase change are validated by the single bubble growth problem. Besides, both phase-change models are shown to provide good predictions against the experimental temperature database, with all of the data points falling within −5% to +20% and −5% to +10% error bands for Lee model and interfacial resistance model, respectively. Furthermore, a liquid-vapor interface region with thin thickness and accurate interface temperature can be obtained by the interfacial resistance model coupled with a homogeneous nucleation-site model.

中文翻译:

歧管微通道散热器中过冷流沸腾的模拟

摘要 歧管微通道 (MMC) 散热器因其高表面积与体积比而成为高热通量热管理新兴技术中最受欢迎的一种。尽管已经对 MMC 散热器中的单相流进行了大量数值研究,但由于流型预测存在问题,因此很少报道对此类微通道中两相流沸腾/冷凝的研究。在目前的工作中,对简化的 MMC 晶胞模型进行了涉及两相界面捕获、相变和固体热传导的数值方法。Lee模型和相变界面热阻模型的传热传质通过单气泡生长问题得到验证。除了,两种相变模型都显示出对实验温度数据库的良好预测,对于 Lee 模型和界面电阻模型,所有数据点都落在 -5% 到 +20% 和 -5% 到 +10% 的误差范围内,分别。此外,通过界面电阻模型与均匀成核位点模型相结合,可以获得具有薄厚度和精确界面温度的液-气界面区域。
更新日期:2020-04-07
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