Lead silicate glasses reduced by hydrogen have the characteristics of conductivity like semiconductors and surface secondary electron emission. Therefore, lead silicate glass is the important material of microchannel plate (MCP) for electron multiplier element. The change of bulk resistance (BR) of lead silicate glass (LSG) with hydrogen reducing time and temperature, and hydrogen flow was investigated. The effect of various hydrogen‐reducing parameters on BR is firstly decreasing, then keeping level, and finally increasing. The tendency presents V‐shaped curve. By analyzing the surface composition and morphology of LSG, it is found that the quantity and aggregation state of lead and bismuth are the key factors determining the conductivity of LSG. It is indicated that the electrical conduction is derived from ions and electrons of LSG. The conductive mechanism, however, is different in different stages in the V‐shaped curve. The discovery of V‐shape curve and the conduction mechanism at different stages have important theoretical guiding significance for the fabrication of microchannel plates.

中文翻译：

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微通道板用还原硅酸铅玻璃的导电机理

氢还原的硅酸铅玻璃具有像半导体一样的导电性和表面二次电子发射的特性。因此，硅酸铅玻璃是用于电子倍增元件的微通道板（MCP）的重要材料。研究了硅铅玻璃（LSG）的体积电阻（BR）随氢气还原时间和温度的变化以及氢气流量的变化。各种减氢参数对BR的影响是先减小，然后保持水平，最后增加。趋势呈现V形曲线。通过分析LSG的表面组成和形貌，发现铅和铋的数量和聚集状态是决定LSG电导率的关键因素。结果表明，导电是由LSG的离子和电子产生的。但是，V形曲线的不同阶段的导电机理是不同的。V形曲线的发现和不同阶段的传导机理对微通道板的制造具有重要的理论指导意义。