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Effect of relative humidity on the corrosion behavior of Sn–0.7Cu solder under polyvinyl chloride fire smoke atmosphere
Materials and Corrosion ( IF 1.6 ) Pub Date : 2020-04-23 , DOI: 10.1002/maco.202011604
Qian Li 1 , Jin Lin 1 , Changhai Li 1 , Shouxiang Lu 1 , Xiao Chen 1
Affiliation  

The effect of environment relative humidity (RH) on the corrosion behavior of Sn–0.7Cu solder was investigated by the weight loss method and surface characterization techniques. In this study, RH ranging from 50% to 98% was researched. The results show that the corrosion degree is getting worse from 50% RH to 90% RH. However, the corrosion rate at 98% RH is lower than that at 90% RH, which may be ascribed to the degree of oxygen diffusion in electrolyte layers of different thicknesses. The microstructure characterization proved that the corrosion products exhibit a superimposed growth and present the same corrosion degree variation trend as the corrosion kinetics. The compositions of corrosion products are examined, and Sn21Cl16(OH)14O6, SnO, and SnO2 are the main corrosion products.

中文翻译:

相对湿度对聚氯乙烯火烟环境下Sn–0.7Cu焊料腐蚀行为的影响

通过失重法和表面表征技术研究了环境相对湿度(RH)对Sn–0.7Cu焊料腐蚀行为的影响。在这项研究中,研究了相对湿度从50%到98%。结果表明,腐蚀程度从50%RH到90%RH越来越差。然而,在98%RH下的腐蚀速率低于在90%RH下的腐蚀速率,这可以归因于不同厚度的电解质层中氧的扩散程度。显微组织表征证明腐蚀产物表现出叠加的生长,并且呈现出与腐蚀动力学相同的腐蚀程度变化趋势。检查腐蚀产物的组成,并检测Sn 21 Cl 16(OH)14 O 6,SnO和SnO 2是主要的腐蚀产物。
更新日期:2020-04-23
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