Secondary ion mass spectrometry (SIMS), X‐ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM) represent three surface analysis techniques heavily used in the complementary metal oxide semiconductor (CMOS) industry. The maturity of these techniques is demonstrated by (a) the diversity of lab‐based instruments used in research and development (R&D) as well as to support fab‐related issues and (b) the fact that highly automated platforms have now been or are being introduced into the fab for process control. Some recent developments of interest in the lab R&D space include the following: (a) the introduction of Orbitrap mass spectrometers into SIMS, (b) the introduction of higher energy monochromated photon sources into standalone lab‐based XPS, and (c) the introduction of commercialized vacuum–scanning probe microscopy (SPM) platforms. The possibilities this opens are demonstrated through (a) SIMS analysis of organics from photoresist materials, (b) XPS subsurface analysis, ie, beyond the sputter front during depth profiling, and (c) SPM analysis of 2D material properties sensitive to the ambient environment, to mention a few.

中文翻译：

---

半导体行业中的表面分析：当前用途和未来可能性

二次离子质谱（SIMS），X射线光电子能谱（XPS）和原子力显微镜（AFM）代表了互补金属氧化物半导体（CMOS）行业中广泛使用的三种表面分析技术。（a）研究与开发（R＆D）中使用的基于实验室的仪器的多样性以及支持与晶圆厂相关的问题，以及（b）高度自动化的平台已经存在或正在成为现实，这证明了这些技术的成熟。被引入晶圆厂进行过程控制。实验室研发领域的一些最新进展包括：（a）将Orbitrap质谱仪引入SIMS，（b）将高能单色光子源引入基于实验室的独立XPS中，（c）引入商业化的真空扫描探针显微镜（SPM）平台。通过（a）对光致抗蚀剂材料中的有机物进行SIMS分析，（b）XPS次表面分析（即深度剖析过程中超出溅射前沿）以及（c）对环境敏感的2D材料特性的SPM分析，证明了这种可能性。 ，提几个。