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Meeting Thermal Safe Power in Fault-Tolerant Heterogeneous Embedded Systems
IEEE Embedded Systems Letters ( IF 1.7 ) Pub Date : 2020-03-01 , DOI: 10.1109/les.2019.2931882
Mohsen Ansari , Mostafa Pasandideh , Javad Saber-Latibari , Alireza Ejlali

Due to the system-level power constraints, it is encountered that not all cores in a multicore chip can be simultaneously powered-on at the highest voltage/frequency levels. Also, in the future technology nodes, reliability issues due to the susceptibility of systems to transient faults should be considered in multicore platforms. Therefore, two major objectives in designing multicore embedded systems are low energy/power consumption and high reliability. This letter presents an energy management system that optimizes the energy consumption such that it satisfies reliability target and meets timing, thermal design power (TDP) and thermal safe power (TSP) constraints. Toward the TDP/TSP-constrained energy-reliability optimization, the proposed method schedules periodic real-time applications on different types of cores with voltage/frequency variations for heterogeneous multicore embedded systems. Experiments show that our proposed system provides up to 38.19% (in average by 29.66%) energy saving and up to 54.73% peak power reduction (in average by 24.55%) under different reliability targets and TDP/TSP constraints when compared to the state-of-the-art techniques.

中文翻译:

在容错异构嵌入式系统中满足热安全电源

由于系统级功率限制,遇到并非多核芯片中的所有内核都可以在最高电压/频率级别同时上电的情况。此外,在未来的技术节点中,由于系统对瞬态故障的敏感性,应该在多核平台中考虑可靠性问题。因此,设计多核嵌入式系统的两个主要目标是低能耗/功耗和高可靠性。这封信提出了一种能源管理系统,该系统可以优化能源消耗,使其满足可靠性目标并满足时序、热设计功率 (TDP) 和热安全功率 (TSP) 约束。面向 TDP/TSP 约束的能源可靠性优化,所提出的方法为异构多核嵌入式系统调度具有电压/频率变化的不同类型内核上的周期性实时应用。实验表明,与状态相比,我们提出的系统在不同的可靠性目标和 TDP/TSP 约束下提供高达 38.19%(平均 29.66%)的节能和高达 54.73% 的峰值功率降低(平均 24.55%) -最先进的技术。
更新日期:2020-03-01
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