Abstract Lead free (LF) solders such as tin silver copper (SAC) and its variations have been used in microelectronic products for the past decade due the Restriction of Hazardous Substances regulation. In use, temperature cycling is a major contributor to the wear-out failure mechanisms of solder joints during the life span of electronics. To predict the reliability of electronic solder joints, a fatigue life model is needed. Currently, strain energy density based models are widely used for solder joint fatigue life estimation. This paper reviews existing LF solder fatigue life models and provides strain energy based life model constants for a variety of LF solder materials.

中文翻译：

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基于能量的温度循环诱导锡银铜焊料互连疲劳寿命建模

摘要 由于有害物质限制规定，无铅 (LF) 焊料如锡银铜 (SAC) 及其变体在过去十年中一直用于微电子产品。在使用中，温度循环是电子设备使用寿命期间焊点磨损失效机制的主要原因。为了预测电子焊点的可靠性，需要一个疲劳寿命模型。目前，基于应变能密度的模型被广泛用于焊点疲劳寿命估计。本文回顾了现有的 LF 焊料疲劳寿命模型，并为各种 LF 焊料材料提供了基于应变能的寿命模型常数。