Flexible electronic devices consisting of sensors and interconnects integrated with a soft polymer platform are being considered for emerging applications such as smart clothing, soft robotics, conformal batteries, and biomonitoring decals. Fabrication processes for such devices can require that the polymer platform be subjected to temperatures up to 300 ◦C without a significant deterioration of its physical properties such as stretchability and stiffness. In this communication, we report the stress–strain behavior of relatively thin sheets of polydimethylsiloxane (PDMS) polymer (thickness ∼30 μm) made with a base-to-hardener ratio of 20:1 and heated up to 300 ◦C in a vacuum environment. It is shown that in spite of the exposure to high temperatures used in this study, the PDMS sheets maintained their hyperelastic behavior as represented by the Ogden model. The elastic modulus is shown to decrease from 0.81 MPa to 0.62 MPa while average strain to failure is shown to decrease from 250% to 106% as the temperature of thermal exposure in vacuum is increased from 100 ◦C to 300 ◦C. The retention of high stretchability even after the thermal exposures opens up the possibility of high-density microelectronic circuit interconnects to be fabricated on PDMS substrates. Supplementary material for this article is available online

中文翻译：

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在真空环境中暴露于高达 300 °C 的热历史的聚二甲基硅氧烷 (PDMS) 的机械特性

由与软聚合物平台集成的传感器和互连组成的柔性电子设备正在考虑用于新兴应用，例如智能服装、软机器人、保形电池和生物监测贴花。此类设备的制造过程可能要求聚合物平台承受高达 300 摄氏度的温度，而其物理性能（如拉伸性和刚度）不会显着劣化。在本次交流中，我们报告了相对薄的聚二甲基硅氧烷 (PDMS) 聚合物片（厚度约 30 μm）的应力 - 应变行为，其基料与硬化剂的比例为 20:1，并在真空中加热至 300 ºC环境。结果表明，尽管暴露在本研究中使用的高温下，PDMS 片材保持其由 Ogden 模型表示的超弹性行为。当真空中的热暴露温度从 100°C 增加到 300°C 时，弹性模量从 0.81 MPa 减少到 0.62 MPa，而平均破坏应变从 250% 减少到 106%。即使在热暴露之后仍保持高拉伸性开辟了在 PDMS 基板上制造高密度微电子电路互连的可能性。本文的补充材料可在线获取 即使在热暴露之后仍保持高拉伸性开辟了在 PDMS 基板上制造高密度微电子电路互连的可能性。本文的补充材料可在线获取 即使在热暴露之后仍保持高拉伸性开辟了在 PDMS 基板上制造高密度微电子电路互连的可能性。本文的补充材料可在线获取