This Special Issue is dedicated to recent research in the field of compact modelling for circuit design. The topics included all device structures, provided it was demonstrated thet the presented compact modelling solutions were implementable in circuit design tools. The last Special Issue addressing compact modelling of all types of semiconductor devices was published in 2006. Since then, new device structures, and with different materials, have emerged, and significant and successful research in compact advance device modeling has been done, as well in the application of compact models to circuit design. Therefore, it was necessary a new Special Issue which could include high quality papers in these topics.

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前言

本期专刊致力于电路设计紧凑模型领域的最新研究。主题包括所有器件结构，并提供了演示的紧凑建模解决方案可在电路设计工具中实现的演示。上一期针对所有类型的半导体器件的紧凑建模的特刊于2006年出版。从那时起，出现了具有不同材料的新型器件结构，并且在紧凑型先进器件建模领域也进行了重要而成功的研究。紧凑模型在电路设计中的应用。因此，有必要出版一本新的特刊，其中可能包含这些主题的高质量论文。