This Special Issue is dedicated to recent research in the field of compact modelling for circuit design. The topics included all device structures, provided it was demonstrated thet the presented compact modelling solutions were implementable in circuit design tools. The last Special Issue addressing compact modelling of all types of semiconductor devices was published in 2006. Since then, new device structures, and with different materials, have emerged, and significant and successful research in compact advance device modeling has been done, as well in the application of compact models to circuit design. Therefore, it was necessary a new Special Issue which could include high quality papers in these topics.

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 前言


本期特刊致力于电路设计紧凑建模领域的最新研究。这些主题包括所有器件结构，前提是所提出的紧凑建模解决方案可以在电路设计工具中实现。上一期涉及所有类型半导体器件紧凑建模的特刊于 2006 年出版。从那时起，新的器件结构和不同材料不断出现，并且在紧凑先进器件建模方面也取得了重大而成功的研究。紧凑模型在电路设计中的应用。因此，有必要发行新的特刊，其中可以包含这些主题的高质量论文。