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Impact of drain doping engineering on ambipolar and high-frequency performance of ZHP line-TFET
Semiconductor Science and Technology ( IF 1.9 ) Pub Date : 2020-04-22 , DOI: 10.1088/1361-6641/ab7ce7
Sasmita Sahoo 1 , Sidhartha Dash 1 , Soumya Ranjan Routray 2 , Guru Prasad Mishra 3
Affiliation  

In this paper, we present a new Z-shaped line tunnel field effect transistor (TFET) employing drain doping engineering with a split drain structure (SD-ZHP-TFET). The split drain (SD) approach in the proposed ZHP-TFET helps increasing tunneling width at the channel-drain interface, reducing ambipolarity. Moreover, a horizontal pocket (HP) is implanted in the source region to boost the ON-current of the proposed SD-ZHP-TFET structure. The effect of both these approaches in the line-TFET provides higher ON-current and reduces ambipolarity significantly. Split drain structure in the ZHP-TFET exhibits a three-decade improvement in the ambipolar current without affecting the subthreshold (SS) and leakage current significantly. A calibrated simulation study of split drain thickness (tu) and drain region doping variation on the analog performance are investigated using the technology computer-aided design device simulator. Moreover, the high-frequency figure of merit regarding total gate capacitance (Cgg), unit-gain cut-off frequency (fT) is analysed. It is found that the drain doping improves the cut-off frequency from 1.8 GHz in ZHP-TFET to 2.2 GHz in the proposed SD-ZHP-TFET structure. Thus the proposed device is capable of providing higher ION/IOFF (≈1013) and ION/IAMB (≈1013) ratio with an average SS of 44 mV/decade.

中文翻译:

漏极掺杂工程对 ZHP line-TFET 双极性和高频性能的影响

在本文中,我们提出了一种采用漏极掺杂工程的新型 Z 形线隧道场效应晶体管 (TFET),该晶体管具有分裂漏极结构 (SD-ZHP-TFET)。所提出的 ZHP-TFET 中的分裂漏极 (SD) 方法有助于增加沟道 - 漏极界面处的隧道宽度,减少双极性。此外,在源区中注入了一个水平口袋 (HP),以提高所提出的 SD-ZHP-TFET 结构的导通电流。在线 TFET 中这两种方法的效果提供了更高的导通电流并显着降低了双极性。ZHP-TFET 中的分体漏极结构在双极电流方面表现出三年的改进,而不会显着影响亚阈值 (SS) 和泄漏电流。使用技术计算机辅助设计器件模拟器,对分裂漏极厚度 (tu) 和漏极区掺杂变化对模拟性能的校准模拟研究进行了研究。此外,还分析了关于总栅极电容 (Cgg)、单位增益截止频率 (fT) 的高频品质因数。发现漏极掺杂将截止频率从 ZHP-TFET 中的 1.8 GHz 提高到所提出的 SD-ZHP-TFET 结构中的 2.2 GHz。因此,所提出的器件能够提供更高的 ION/IOFF (≈1013) 和 ION/IAMB (≈1013) 比,平均 SS 为 44 mV/decade。发现漏极掺杂将截止频率从 ZHP-TFET 中的 1.8 GHz 提高到所提出的 SD-ZHP-TFET 结构中的 2.2 GHz。因此,所提出的器件能够提供更高的 ION/IOFF (≈1013) 和 ION/IAMB (≈1013) 比,平均 SS 为 44 mV/decade。发现漏极掺杂将截止频率从 ZHP-TFET 中的 1.8 GHz 提高到所提出的 SD-ZHP-TFET 结构中的 2.2 GHz。因此,所提出的器件能够提供更高的 ION/IOFF (≈1013) 和 ION/IAMB (≈1013) 比,平均 SS 为 44 mV/decade。
更新日期:2020-04-22
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