Biomass of Penicillium sp. MRF1 was evaluated as a biosorbent for the removal of nickel (II) ions from electroplating industrial effluent. The fungal biomass was found to be efficient for the removal of Ni (II) ions. Response surface methodology (RSM) was performed to analyze the single and combined effect of three variables such as concentration of fungal biomass, pH, and contact time to obtain the maximum removal of nickel from electroplating industrial effluent. The rate of Ni (II) ions removal from electroplating industrial effluent was attained after 140 min (74.6%). The optimum biosorption conditions for maximum removal of nickel from an aqueous solution (initial concentration of nickel, 639 mg/L) obtained were as follows: fungal biomass (7.5 g/L), pH (5.5), and contact time (140 min). This was evidenced by the higher value of coefficient of determination (R² = 0.96072) suggested that all three variables have positive effect on the removal of Ni (II) ions. Equilibrium data of adsorption isotherm equilibrium models significantly fit with Freundlich isotherm model. The heterogeneous surface adsorption capacity of the isolated fungus Penicillium sp. for nickel (II) ions was found as 63.6 mg/g. The surface of fungal biomass was characterized by SEM and FT-IR. The biosorption mechanism was ascribed to the presence of functional groups like –OH, C–O, C=O, and N–H. Penicillium sp. MRF1 biomass seems to be quite feasible for the removal of nickel (II) ions from nickel electroplating industrial effluent.

青霉的生物量sp。MRF1被评估为从电镀工业废水中去除镍（II）离子的生物吸附剂。发现真菌生物质对于去除Ni（II）离子是有效的。进行了响应表面方法（RSM）来分析三个变量（例如真菌生物质的浓度，pH和接触时间）的单一和组合影响，以从电镀工业废水中获得最大的镍去除率。140分钟（74.6％）后，从电镀工业废水中去除镍（II）离子的速率达到了。获得的最大的从水溶液中去除镍的最佳生物吸附条件（镍的初始浓度，639 mg / L）如下：真菌生物质（7.5 g / L），pH（5.5）和接触时间（140分钟） 。较高的确定系数值证明了这一点（R ²  = 0.96072）表明所有三个变量均对Ni（II）离子的去除具有积极作用。吸附等温线平衡模型的平衡数据与Freundlich等温线模型非常吻合。所述分离的真菌的异质表面的吸附能力青霉属。镍（II）离子的残留量为63.6 mg / g。用SEM和FT-IR对真菌生物量的表面进行表征。这种生物吸附机制归因于官能团的存在，例如–OH，C–O，C = O和N–H。青霉属。MRF1生物质对于从电镀镍工业废水中去除镍（II）离子似乎非常可行。