This paper reports for the first time on a micromachined interposer platform for characterizing highly miniaturized multi-port sub-THz waveguide components. The reduced size of such devices does often not allow to connect them to conventional waveguide flanges. We demonstrate the micromachined interposer concept by characterizing a miniaturized, three-port, 220–330-GHz turnstile orthomode transducer. The interposer contains low-loss micromachined waveguides for routing the ports of the device under test to standard waveguide flanges and integrated micromachined matched loads for terminating the unused ports. In addition to the interposer, the measurement setup consists of a micromachined square-to-rectangular waveguide transition. These two devices enable the characterization of such a complex microwave component in four different configurations with a standard two-port measurement setup. In addition, the design of the interposer allows for independent characterization of its sub-components and, thus, for accurate de-embedding from the measured data, as demonstrated in this paper. The measurement setup can be custom-designed for each silicon micromachined device under test and co-fabricated in the same wafer due to the batch nature of this process. The solution presented here avoids the need of CNC-milled test-fixtures or waveguide pieces that deteriorate the performance of the device under test and reduce the measurement accuracy.

中文翻译：

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微加工波导插入器，用于表征多端口亚太赫兹设备

本文首次在微加工中介层平台上进行了报道，以表征高度小型化的多端口亚太赫兹波导组件。这样的装置的减小的尺寸通常不允许将它们连接到传统的波导凸缘。我们通过表征一个微型的三端口，220-330GHz旋转栅正模换能器来证明微加工中介层的概念。插入器包含用于将被测设备的端口路由到标准波导法兰的低损耗微加工波导，以及用于终止未使用的端口的集成微加工匹配负载。除中介层外，测量设置还包括微加工的正方形到矩形波导过渡。通过标准的两端口测量设置，这两种设备可以表征四种不同配置中的此类复杂微波组件。此外，中介层的设计允许对其子组件进行独立表征，从而可以从测量数据中进行准确的去嵌入，如本文所述。由于此过程的批量性质，可以为每个被测试的硅微机械设备定制设计测量设置，并在同一晶片中共同制造。此处提出的解决方案避免了使用CNC铣削的测试夹具或波导件，而这些夹具或波导件会降低被测设备的性能并降低测量精度。中介层的设计允许对其子组件进行独立表征，从而可以从测量数据中进行准确的去嵌入，如本文所述。由于此过程的批量性质，可以为每个被测试的硅微机械设备定制设计测量设置，并在同一晶片中共同制造。此处提出的解决方案避免了使用CNC铣削的测试夹具或波导件，而这些夹具或波导件会降低被测设备的性能并降低测量精度。中介层的设计允许对其子组件进行独立表征，从而可以从测量数据中进行准确的去嵌入，如本文所述。由于此过程的批量性质，可以为每个被测试的硅微机械设备定制设计测量设置，并在同一晶片中共同制造。此处提出的解决方案避免了使用CNC铣削的测试夹具或波导件，而这些夹具或波导件会降低被测设备的性能并降低测量精度。