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Chemical Mechanical Polishing (CMP) of Fused Silica (FS) Using Ceria Slurry Recycling
ECS Journal of Solid State Science and Technology ( IF 1.8 ) Pub Date : 2020-04-08 , DOI: 10.1149/2162-8777/ab8391
Yan Zhou 1, 2, 3 , Haimei Luo 1, 2, 3 , Guihai Luo 1, 2, 3 , Gaopan Chen 1, 2, 3 , Chengxi Kang 1 , Guoshun Pan 1, 2, 3
Affiliation  

Due to its high optical permeability, excellent high temperature resistance, and chemical inertness, fused silica (FS) has been widely used in astronomical telescopes, laser systems, and optical communication. Based on the smooth surface polishing of fused silica using ceria slurry, the variations of polishing performance of fused silica in the recycling polishing were studied. Meanwhile, the variations of the ceria slurry characteristics in chemical mechanical polishing (CMP) of fused silica were investigated. The variations of the average size and the morphology of the abrasive ceria particles were measured. X-Ray photoelectron spectroscopy (XPS) measurement was used to evaluate the chemical state of the ceria slurry in different recycling polishing time. Then, elastic moduli via atomic force microscope (AFM) force curves measurement of the abrasive ceria particles were measured and analyzed. And the change of shear viscosity of the slurry was monitored. In addition, the relat...

中文翻译:

使用氧化铈浆料回收的熔融石英(FS)的化学机械抛光(CMP)

由于其高的光学渗透性,出色的耐高温性和化学惰性,熔融石英(FS)已被广泛用于天文望远镜,激光系统和光通信中。基于二氧化铈浆料对熔融石英的光滑表面抛光,研究了循环抛光中熔融石英抛光性能的变化。同时,研究了熔融石英化学机械抛光(CMP)过程中二氧化铈浆料特性的变化。测量了磨料二氧化铈颗粒的平均尺寸和形态的变化。X射线光电子能谱(XPS)测量被用于评估在不同的循环抛光时间内二氧化铈浆料的化学状态。然后,通过原子力显微镜(AFM)的弹性模量测量磨料氧化铈颗粒的力曲线并进行分析。并监测浆料的剪切粘度的变化。此外,相关...
更新日期:2020-04-20
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