Silicon-based multi-junction (tandem) technology is one potential route to the next breakthrough for terrestrial photovoltaic conversion. Significant progress has been made in tandem solar cells. To move forward, development of tandem module technology is essential. Here, we theoretically compare five possible tandem module architectures with multiple material combinations by modeling their outdoor performance ratios around the globe. This framework aids in evaluating future module designs and technology pathways by relating lab-based efficiency to field performance and even project financing. We find that tandem performance ratios depend notably on climate conditions. In general, three-terminal and mechanically voltage-matched modules show exceptionally good outdoor performance. Furthermore, we investigate the implications of technical performance on manufacturing cost globally and find that tandems are promising in high-value markets in arid climates, where a three to five times increase in the current silicon module manufacturing cost is allowed under an optimistic scenario.

硅基多结（串联）技术是实现地面光伏转换的下一个突破的一种潜在途径。串联太阳能电池已取得重大进展。为了向前发展，串联模块技术的发展至关重要。在这里，我们通过对全球户外性能比率建模，从理论上比较了五种可能的串联模块架构与多种材料组合。该框架通过将基于实验室的效率与现场绩效甚至项目融资联系起来，有助于评估未来的模块设计和技术途径。我们发现串联性能比明显取决于气候条件。通常，三端子和机械电压匹配的模块显示出异常好的户外性能。此外，