This letter presents the first successful on-wafer fabrication and characterization of a fully monolithic air-filled half-mode waveguide (HMWG) for millimeter waves. Utilizing a flexible microfabrication process, a thick sacrificial layer is employed to build and then release 3-D structures on-wafer. The measured prototype achieves an attenuation of 0.31 dB/mm at 85 GHz, while miniaturizing the footprint of the conventional waveguide by 56%. The proposed concept highlights the potential of monolithic HMWGs for enhanced integration technology suitable for high-performance millimeter-wave 5G communication systems.

中文翻译：

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用于毫米波应用的单片充气半模波导的微细加工

这封信展示了用于毫米波的完全单片充气半模波导 (HMWG) 的首次成功晶圆上制造和表征。利用灵活的微制造工艺，采用厚的牺牲层在晶圆上构建和释放 3D 结构。测得的原型在 85 GHz 下实现了 0.31 dB/mm 的衰减，同时将传统波导的占地面积缩小了 56%。提议的概念突出了单片 HMWG 在适用于高性能毫米波 5G 通信系统的增强集成技术方面的潜力。