Photonic integration opens the potential to reduce size, power, and cost of applications normally relegated to table- and rack-sized systems. Today, a wide range of precision, high-end, ultra-sensitive, communication and computation, and measurement and scientific applications, including atomic clocks, quantum communications, processing, and high resolution spectroscopy, are ready to make the leap from the lab to the chip. However, many of these applications operate at wavelengths not accessible to the silicon on insulator-based silicon photonics integration platform due to absorption, power handling, unwanted nonlinearities, and other factors. Next generation photonic integration will require ultra-wideband photonic circuit platforms that scale from the ultraviolet to the infrared and that offer a rich set of linear and nonlinear circuit functions as well as low loss and high power handling capabilities. This article provides an assessment of the field in ultra-wideband photonic waveguides to bring power efficient, ultra-high performance systems to the chip-scale and enable compact transformative precision measurement, signal processing, computation, and communication techniques.

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适用于UV到IR应用的光子集成

光子集成具有减小通常用于台式和机架式系统的应用的尺寸，功耗和成本的潜力。如今，包括原子钟，量子通信，处理和高分辨率光谱学在内的各种精度，高端，超灵敏，通信和计算以及测量和科学应用，都已准备好从实验室飞跃到芯片。然而，由于吸收，功率处理，不希望的非线性和其他因素，许多这些应用在基于绝缘体上的硅光子集成平台上的硅无法访问的波长下工作。下一代光子集成将需要从紫外到红外缩放的超宽带光子电路平台，并提供丰富的线性和非线性电路功能集以及低损耗和高功率处理能力。本文提供了对超宽带光子波导领域的评估，以将功率高效的超高性能系统带到芯片级，并实现紧凑的变换精度测量，信号处理，计算和通信技术。