This study presents the microplasma direct writing of copper film in the open air using a novel copper powder electrode. The powder electrode acted as a high‐voltage electrode and the precursor source. The deposition process is realized through ion sputtering of the powder in the microplasma. The bombarded copper nanoparticles were deposited and accumulated on a silicon substrate. The deposited film is composed of copper nanoparticles with sizes in the range from tens to hundreds of nanometers, and its electrical conductivity could reach 3.96 × 10⁵ S/m. The morphologies, chemical compositions and electrical property of the thin film can be adjusted by changing the input current, and maskless film deposition with different micropatterns can be achieved by direct microplasma scanning.

中文翻译：

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利用新型铜粉电极在大气条件下通过微等离子体直接写入铜薄膜

这项研究提出了使用新型铜粉电极在露天中直接写铜膜的微等离子体。粉末电极充当高压电极和前驱物源。沉积过程是通过微等离子体中粉末的离子溅射来实现的。被轰击的铜纳米颗粒沉积并累积在硅基板上。沉积膜由大小为几十纳米至数百纳米的铜纳米颗粒组成，其电导率可达到3.96×10 ⁵  S / m。可以通过改变输入电流来调节薄膜的形态，化学组成和电性能，并且可以通过直接的微等离子体扫描来实现具有不同微图案的无掩模膜沉积。