The effect of high temperature on the interface microstructure and interfacial shear strength of the continuous SiC fiber reinforced AlFe5Si2 matrix (45 vol.% SiC_f/AlFe5Si2) composite was investigated. The composite was prepared by hot isostatic pressing (HIP), and then thermally exposed at 260/300/350/400/450 °C for 20/50/100 h, respectively. The interfacial shear strength of the composite with and without thermal exposure was measured by push-out test. The interface microstructure and phase compositions of the composite with and without thermal exposure were characterized by scanning electron microscopy, transmission electron microscopy and X-ray diffraction. Results showed that the interfacial reaction took place at the interface between SiC fiber and aluminum matrix and formed Al₄C₃ phase during the preparation process. The activation energy of Al₄C₃ growth at the C/Al interface was about 163 kJ/mol. With increasing the thermal exposure temperature and time, the interfacial shear strength of the composite declined, especially at temperatures above 400 °C. The brittle Al_3.21SiO_0.47 compound formed at temperatures above 400 °C mainly resulted in the severe strength deterioration of the interfacial reaction zone.

研究了高温对连续SiC纤维增强AlFe5Si2基体（45％（体积）SiC _f / AlFe5Si2）复合材料的界面微观结构和界面剪切强度的影响。通过热等静压（HIP）制备复合材料，然后分别在260/300/350/400/450°C下热暴露20/50/100 h。通过推出试验测量在有和没有热暴露的情况下复合材料的界面剪切强度。通过扫描电子显微镜，透射电子显微镜和X射线衍射来表征具有和不具有热暴露的复合材料的界面微观结构和相组成。结果表明，界面反应发生在SiC纤维与铝基体的界面并形成Al ₄制备过程中C ₃相。在C / Al界面处Al ₄ C ₃生长的活化能约为163 kJ / mol。随着热暴露温度和时间的增加，复合材料的界面剪切强度下降，特别是在高于400°C的温度下。在高于400°C的温度下形成的脆性Al _3.21 SiO _0.47化合物主要导致界面反应区的强度严重下降。