Epoxy–thiol–imidazole system is promising for microelectronic packaging areas, such as underfills and low-temperature fast curing adhesives, but there is little knowledge on the corrosion resistance of this system. In this article, the anticorrosion and thermal and mechanical properties were characterized by theoretical and experimental methods and were understood from a fundamental perspective of structure. The cure behaviors were evaluated by differential scanning calorimeter. The mechanical and thermal properties were characterized by dynamic mechanical, thermomechanical, and thermos-gravimetric methods. The water absorption process was monitored using gravimetric measurement. Results show that among compositions of variable thiol–epoxy molar ratios, the one with ratio 0.25 has the best anticorrosion property and improved mechanical property, as well as good water resistance at room temperature. Both the average tensile strength and modulus increased initially and then declined with the addition of thiol part, while the average peel strength increased to above thrice the value of that of neat epoxy–imidazole system for thiol–epoxy 1:1 system.

中文翻译：

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改进性能的环氧-硫醇-咪唑体系的腐蚀保护以及热和机械性能

环氧-硫醇-咪唑体系在微电子封装领域很有前景，例如底部填充胶和低温快速固化粘合剂，但对该体系的耐腐蚀性知之甚少。在本文中，通过理论和实验方法对防腐和热力学性能进行了表征，并从结构的基本角度进行了理解。通过差示扫描量热计评价固化行为。机械和热性能通过动态机械、热机械和热重方法表征。吸水过程使用重量测量来监测。结果表明，在不同硫醇-环氧摩尔比的组合物中，比例为0.25的组合物具有最好的防腐性能和改善的机械性能，以及在室温下良好的耐水性。随着硫醇部分的加入，平均拉伸强度和模量均先增加后下降，而平均剥离强度增加到硫醇 - 环氧 1:1 体系的纯环氧 - 咪唑体系值的三倍以上。