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Fabrication of multi-filler thermoset-based composite bipolar plates for PEMFCs applications: Molding defects and properties characterizations
International Journal of Hydrogen Energy ( IF 8.1 ) Pub Date : 2020-04-02 , DOI: 10.1016/j.ijhydene.2020.03.105
Sepehr Simaafrookhteh , Majid Khorshidian , Mohammad Momenifar

The bipolar plate (BP) material should possess contradictory properties. They should also manufacture from low-cost methods and materials. In the current investigation, thermoset-based composite materials reinforced with conductive fillers, and the compression molding process is implemented. In addition to fabricating the bipolar plates (BPs) with and without the flowing channels, alleviating the defects during the molding process is performed. The channels are perfectly formed on the plates with the designed depth of 0.65 mm and 0.5 mm of width. In the meanwhile, we alleviate different molding defects, which spoil the surface appearance and part properties. Regarding the physical properties, the water contact angle is measured to be around 85°. The through-plane electrical conductivity of molded plates showed high values up to 38 S/cm, and the interfacial contact resistance measured to be 18–24 mΩ cm2. The mean value of the flexural strength of the produced samples was equal to 47 MPa, which is almost twice the DOE target (>25 MPa).



中文翻译:

用于PEMFC的多填充热固性复合双极板的制造:成型缺陷和性能表征

双极板(BP)材料应具有矛盾的属性。它们还应使用低成本的方法和材料制造。在目前的研究中,采用热固性复合材料增强了导电填料,并实施了压模工艺。除了制造具有和不具有流动通道的双极板(BP)之外,还可以减轻模制过程中的缺陷。通道完美地形成在板上,设计深度为0.65毫米,宽度为0.5毫米。同时,我们减轻了不同的成型缺陷,破坏了表面外观和零件性能。关于物理性质,水接触角经测量为约85°。模压板的贯穿面电导率显示出高达38 S / cm的高值,2。所生产样品的抗弯强度平均值等于47 MPa,几乎是DOE目标的两倍(> 25 MPa)。

更新日期:2020-04-02
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