Uncontrolled dumping and incineration of resin particles of waste printed circuit boards had caused serious pollution due to the contained brominated flame retardants. High-temperature vacuum pyrolysis was proposed to treat the resin particles. However, due to the generation of brominated gases and solid floc, high-temperature vacuum pyrolysis reproduced more hazardous wastes. In this paper, resin particles of crushed waste circuit board were processed by vacuum heating at the temperature of 300 °C and condensation at 180 °C. Resin particles were converted into residue and oil with the mass ratios 84.0 wt% and 16.0 wt% respectively. Content of organic bromine in residue was reduced to 0.082 wt%. Meanwhile, morphology of resin in residue was basically unchanged, which could be directly recycled as the filler for building materials. About 95.4 wt% of bromine in resin particles was transferred to oil. These results achieved the reduction of the hazardous wastes. Compared with the high-temperature vacuum pyrolysis, low-temperature heating not only reduce energy consumption, but also reduce the generation of toxic products. This paper might be the first time to report low-temperature heating of resin particles of waste printed circuit boards. This study contributed a novel technology to remove bromine from brominated substrates.

废印刷电路板中树脂颗粒的不加控制的倾倒和焚烧由于所含的溴化阻燃剂而造成了严重的污染。提出了高温真空热解法处理树脂颗粒的方法。但是，由于产生了溴化气体和固体絮凝物，高温真空热解产生了更多的有害废物。在本文中，通过在300°C的温度下真空加热并在180°C的冷凝条件下处理碎废电路板的树脂颗粒。树脂颗粒分别以质量比84.0重量％和16.0重量％转化为残余物和油。残留物中有机溴的含量降低至0.082重量％。同时，残留物中树脂的形态基本不变，可以直接用作建筑材料的填料。大约95。将树脂颗粒中的4 wt％的溴转移到油中。这些结果实现了有害废物的减少。与高温真空热解相比，低温加热不仅减少了能耗，而且减少了有毒产物的产生。本文可能是第一次报告废印刷电路板的树脂颗粒的低温加热。这项研究贡献了一种从溴化基质中去除溴的新技术。本文可能是第一次报告废印刷电路板的树脂颗粒的低温加热。这项研究贡献了一种从溴化基质中去除溴的新技术。本文可能是第一次报道废印刷电路板的树脂颗粒的低温加热。这项研究贡献了一种从溴化基质中去除溴的新技术。