Anodic bonding technique has been extensively utilized in the micro-electromechanical systems (MEMS) packaging or solar cell sealing. Nevertheless, the traditional power source for bonding method needs both high voltage and high current, which limits the widespread applications of anodic bonding and also gives rise to energy consumption. Therefore, for the first time, triboelectric nanogenerator (TENG) is used to drive anodic bonding. The TENG-based Anodic bonding system features lower current and much less transferred charges requirement, while no pre-tensile strength of the bonded pairs is needed to achieve completed bonding. Under the drive of TENG, the silicon-glass interface with the size of 100 mm² can be tightly bonded within 40 s, which is comparable with the results driven by commercial power source. In addition, triple-stack anodic bonding driven by TENG through a two-step bonding process can be realized effectively with good reliability. This TENG-based Anodic bonding system with simple design and zero power consumption can significantly improve applications of anodic bonding in many fields, while it also opens up a promising utilization direction of the current signal of TENG.

阳极键合技术已广泛用于微机电系统（MEMS）封装或太阳能电池密封中。然而，传统的用于键合方法的电源既需要高电压又需要大电流，这限制了阳极键合的广泛应用，并增加了能耗。因此，摩擦电动纳米发电机（TENG）首次用于驱动阳极键合。基于TENG的阳极键合系统具有更低的电流和更少的转移电荷需求，同时不需要键合对的预拉伸强度即可实现完整的键合。在TENG的驱动下，尺寸为100 mm ²的硅玻璃界面可以在40 s内紧密粘合，这可与商用电源驱动的结果相媲美。此外，由TENG通过两步键合工艺驱动的三叠层阳极键合可以高效，可靠地实现。这种基于TENG的阳极键合系统具有简单的设计和零功耗，可以显着改善阳极键合在许多领域的应用，同时也为TENG的电流信号的使用开辟了广阔的前景。