Materials with low dielectric constant have drawn more and more attention due to their wide range of applications in electronic devices. Two type of methods are often used to reduce the dielectric constant of a given materials: introducing voids and replacing groups having higher polarizability with the ones having lower through copolymerization. Different from above methods, current study proposes a novel and efficient method by allow inorganic filler participating the curing process of polymer matrix, thus, consuming some of the functional groups with high polarizability. Nickel hydroxide (Ni(OH)₂) is selected as filler to be dispersed in room temperature vulcanized silicone rubber (SR). The addition of 1% Ni(OH)₂ into SR has resulted a decrease in dielectric constant from 3.1 to 2.1, and slightly reduced dielectric loss. With further increasing Ni(OH)₂ content, the dielectric constant increases gradually. From various characterizations, it is confirmed that Ni(OH)₂ is involved in the curing process of SR, thus, the hydroxyl group content in the final composites is reduced. Meanwhile, Ni(OH)₂ with different size and synthesized Ni(OH)₂ from hydrothermal process is also used to further confirm such observation. This method provides a novel route for the preparation of low dielectric constant materials.

具有低介电常数的材料由于在电子设备中的广泛应用而受到越来越多的关注。通常使用两种类型的方法来降低给定材料的介电常数：引入空隙，以及将具有较高极化率的基团替换为具有较低可渗透性的基团。与上述方法不同，当前的研究提出了一种新颖有效的方法，即允许无机填料参与聚合物基体的固化过程，从而消耗一些极化率高的官能团。选择氢氧化镍（Ni（OH）₂）作为填料，以分散在室温硫化的硅橡胶（SR）中。添加1％Ni（OH）₂SR导致介电常数从3.1降低到2.1，并且介电损耗略有降低。随着Ni（OH）₂含量的进一步增加，介电常数逐渐增加。从各种特征可以证实，Ni（OH）₂参与了SR的固化过程，因此最终复合材料中的羟基含量降低了。同时，镍（OH）₂具有不同的尺寸和合成的Ni（OH）₂从水热过程也可以用来进一步证实这种观察。该方法为制备低介电常数材料提供了一条新颖的途径。