Abstract The aim of this study is to investigate the improvement of heat transfer efficiency of the Al and Cu substances by modifying the surfaces with conical nanostructures. The natural evaporation is simulated using the molecular dynamics method for a thin layer of Ar atoms on the solid surface. Moreover, a comparison of heat transfer behavior of the Ar atoms is presented for different substances through a comprehensive investigation. The investigated configurations include smooth Al and Cu surfaces, as well as the surfaces modified by conical Al/Cu nanostructures. Also, the distribution of Al/Cu nanostructures on surfaces is investigated. The results indicate that using Cu surface rather than the Al surface improves the heat transfer efficiency by 16.67%. In comparison with the smooth Al surface, employing conical Al and Cu nanostructures can enhance the heat transfer by 38.89% and 44.44%, respectively. Additionally, it is observed that featuring the Cu surface with Al and Cu nanostructures leads to improvement of heat transfer capability of the surface by and 39.81% and 47.59%, respectively. Furthermore, the effect of conically shaped Cu/Al nanostructures with different distribution but the same contact area to be used on the Al/Cu smooth surface on the heat transfer enhancement is studied. Based on the results, for all the structures in which Cu is considered as the base substance, the fluid temperature reaches the solid temperature faster, compared to Al as the base substance. Also, by embedding the nanostructures on Al and Cu smooth surfaces, the fluid temperature reaches the solid temperature faster in the case of Al/Cu smooth surfaces. Additionally, it is observed that employing the Cu nanostructure instead of the Al on Cu smooth surface is more effective for improving the heat transfer performance.

中文翻译：

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通过锥形铝/铜纳米结构增强传热的分子动力学模拟

摘要 本研究的目的是研究通过用锥形纳米结构修饰表面来提高铝和铜物质的传热效率。使用分子动力学方法模拟固体表面上的 Ar 原子薄层的自然蒸发。此外，通过综合研究，比较了不同物质的 Ar 原子的传热行为。研究的配置包括光滑的铝和铜表面，以及由锥形铝/铜纳米结构改性的表面。此外，还研究了 Al/Cu 纳米结构在表面上的分布。结果表明，使用Cu表面而不是Al表面使传热效率提高了16.67%。与光滑的铝表面相比，采用锥形 Al 和 Cu 纳米结构可以将传热分别提高 38.89% 和 44.44%。此外，观察到以铝和铜纳米结构为特征的铜表面导致表面传热能力分别提高 39.81% 和 47.59%。此外，研究了在Al/Cu光滑表面上使用不同分布但相同接触面积的锥形Cu/Al纳​​米结构对传热增强的影响。结果表明，对于所有以Cu为基体的结构，与以Al为基体的结构相比，流体温度更快地达到固体温度。此外，通过将纳米结构嵌入铝和铜的光滑表面，在铝/铜光滑表面的情况下，流体温度更快地达到固体温度。另外，观察到在Cu光滑表面上使用Cu纳米结构代替Al对于提高传热性能更有效。