Abstract

Double side grinding is a process with high processing efficiency in which the wheel and the workpiece are in surface contact. But the phenomenon that the workpiece surface profile is out of tolerance exists because of the material removal non-uniformity in the grinding process. In order to improve the surface integrity of the ground workpiece, the mathematical models of grinding trajectory distribution and material removal were established on the basis of the double side grinding process. The simulation and experimental research were carried out under different grinding parameters. It was shown that when the grinding wheel rotates in the co-rotation to the workpiece, the surface profile of the workpiece was better than that of the opposite direction. The speed ratio of the grinding wheel to the workpiece had a significant influence on the surface trajectory distribution and material removal uniformity. When the speed ratio was irrational, the trajectory distribution was more uniform. At a lower speed ratio, the surface profile of the workpiece was better. Although the simulation results and the experimental results had a good consistency in the trend, the simulated values were obviously smaller than the experimental values, which indicated that the material removal uniformity based on grain trajectories was not the only influencing factor of the phenomenon of convex in the middle of the workpiece during double side grinding.

中文翻译：

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基于晶粒轨迹的双面磨削表面材料去除均匀性研究

摘要

双面磨削是砂轮与工件表面接触的高加工效率的过程。但是由于磨削过程中材料去除不均匀，存在工件表面轮廓超出公差的现象。为了提高被磨工件的表面完整性，在双面磨削工艺的基础上建立了磨削轨迹分布和材料去除的数学模型。在不同的磨削参数下进行了仿真和实验研究。结果表明，当砂轮与工件共同旋转时，工件的表面轮廓要好于相反方向的表面轮廓。砂轮与工件的速比对表面轨迹分布和材料去除均匀性有重要影响。当速度比不合理时，轨迹分布更加均匀。在较低的速比下，工件的表面轮廓更好。尽管模拟结果和实验结果在趋势上具有很好的一致性，但模拟值明显小于实验值，这表明基于晶粒轨迹的材料去除均匀性并不是影响凸点现象的唯一因素。在双面磨削过程中工件的中间。工件的表面轮廓更好。尽管模拟结果和实验结果在趋势上具有很好的一致性，但模拟值明显小于实验值，这表明基于晶粒轨迹的材料去除均匀性并不是影响凸点现象的唯一因素。在双面磨削过程中工件的中间。工件的表面轮廓更好。尽管模拟结果和实验结果在趋势上具有很好的一致性，但是模拟值明显小于实验值，这表明基于晶粒轨迹的材料去除均匀性并不是影响凸点现象的唯一因素。在双面磨削过程中工件的中间。