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Strain-Rate Sensitivity of Hall-Petch Strengthening in Au(Cu) Electrodeposits
Materials Letters ( IF 2.7 ) Pub Date : 2020-07-01 , DOI: 10.1016/j.matlet.2020.127726
Alan F. Jankowski

Abstract A triboindentation test method is used to reveal a strain-rate sensitivity in the Hall-Petch hardening coefficient that’s representative of grain size effects. For electrodeposited gold-copper alloys, the strain-rate dependent hardening coefficient kH ( e ) equals kHo⋅ e m where kHo equals 1.28 ± 0.02 GPa⋅nm0.5 and the strain-rate sensitivity exponent m equals 0.267 ± 0.014, for those samples with a 5-34 nm grain size as scratch tested in cross-section over a 0.4–150 s−1 strain-rate range e .

中文翻译:

金(铜)电镀中霍尔-佩奇强化的应变率敏感性

摘要 摩擦压痕测试方法用于揭示代表晶粒尺寸效应的霍尔-佩奇硬化系数中的应变率敏感性。对于电沉积金铜合金,应变率相关硬化系数 kH ( e ) 等于 kHo⋅ em 其中 kHo 等于 1.28 ± 0.02 GPa⋅nm0.5 且应变率敏感性指数 m 等于 0.267 ± 0.014,对于那些具有在 0.4-150 s-1 应变率范围 e 的横截面中作为划痕测试的 5-34 nm 晶粒尺寸。
更新日期:2020-07-01
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