Three-Dimensional Networks-on-Chips (3D-NoCs) have been proposed as an auspicious solution, merging the high parallelism of the Network-on-Chip (NoC) paradigm with the high-performance and low-power cost of 3D-ICs. However, as technology scales down, the reliability issues are becoming more crucial, especially for complex 3D-NoC which provides the communication requirements of multi and many-core systems-on-chip. Reliability assessment is prominent for early stages of the manufacturing process to prevent costly redesigns of a target system. In this paper, we present an accurate reliability assessment and quantitative evaluation of a soft-error resilient 3D-NoC based on a soft-error resilient mechanism. The system can recover from transient errors occurring in different pipeline stages of the router. Based on this analysis, the effects of failures in the network's principal components are determined.

中文翻译：

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软错误弹性 3D 片上网络系统的可靠性评估和定量评估

三维片上网络 (3D-NoC) 已被提出作为一种吉祥的解决方案，将片上网络 (NoC) 范式的高并行性与 3D-IC 的高性能和低功耗成本相结合. 然而，随着技术规模的缩小，可靠性问题变得越来越重要，特别是对于复杂的 3D-NoC，它提供了多核和众核片上系统的通信要求。可靠性评估在制造过程的早期阶段非常重要，以防止对目标系统进行代价高昂的重新设计。在本文中，我们提出了基于软错误弹性机制的软错误弹性 3D-NoC 的准确可靠性评估和定量评估。系统可以从路由器不同管道阶段发生的瞬时错误中恢复。基于这一分析，