On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. This work challenges the on-chip antenna design conventions, and pushes toward a Through-Silicon Via-based antenna design called TSV_A that establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30mm on-chip distance. The TSV_A performance is evaluated in both Finite Element Method and system-level Network-on-Chip (NoC) simulations. A comparison to traditional wire-based NoCs, analysis of wireless multi-bands, and technology scaling to demonstrate the substantial area improvements compared to traditional wireless NoCs (up to 99.88%) are performed. Simulation results show an improvement in network latency up to ~13% (average improvement of ~7%), energy-delay improvements of ~34% on average, and an improvement in throughput up to ~34% (average improvement of ~23%), using Wireless NoC with multi-band TSV_As. The improved signal performance of TSV_A, and multi-band capabilities, are ideal for wireless intercell communication for programmable metasurfaces with dedicated communication layers.

中文翻译：

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用于多频段无线通信的 TSV 天线

由于长距离通信、额外的带宽和天线的广播能力，片上无线链路提供了改进的网络性能。这项工作挑战了片上天线设计惯例，并推动了一种名为 TSV_A 的基于硅通孔的天线设计，该设计通过硅衬底介质建立了多频段无线通信，并且在 30 毫米的片上距离上只有 3 dB 的损耗. TSV_A 性能在有限元方法和系统级片上网络 (NoC) 模拟中进行评估。通过与传统有线 NoC 的比较、无线多频段分析和技术扩展，展示了与传统无线 NoC 相比的显着面积改进（高达 99.88%）。仿真结果表明，网络延迟提高了约 13%（平均提高了约 7%），能量延迟平均提高了约 34%，吞吐量提高了约 34%（平均提高了约 23%） )，使用具有多频段 TSV_As 的无线 NoC。TSV_A 改进的信号性能和多频段功能非常适合具有专用通信层的可编程超表面的无线小区间通信。