Over the last few decades, thermal control has become a critical factor in the design of electronic parts because microelectronic heat dissipation has become critical to the performance, reliability, and further miniaturization of microelectronics since high integration of transistors has resulted in the escalation of power dissipation as well as an increase in heat flux at the devices’ systems.^1,2

中文翻译：

---

环氧/碳纤维-碳化硅复合材料的增强的热和电性能

在过去的几十年中，热控制已成为电子零件设计中的关键因素，因为微电子的散热已成为微电子的性能，可靠性和进一步小型化的关键，因为晶体管的高度集成导致功耗不断提高。以及设备系统的热通量增加。^1,2