MEMS atomic vapor cells have a large variety of applications in chip-scale atomic devices such as clocks, gyroscopes or magnetometers. These cells are usually hermetically sealed by anodic bonding of borosilicate to silicon, a proven and reliable method, yet showing specific limitations such as inherent oxygen contamination of the cavity or limitation to a few combinations of materials. As an alternative, we report on the successful wafer-level fabrication of cells sealed by Cu-Cu thermocompression bonding. This alternative technique allows to overcome the constraints of anodic bonding while allowing a new variety of other materials. Characterization of the bonding quality is presented as well as a spectroscopic characterization in view of use for chip-scale atomic clocks (CSACs). [2019-0151]

中文翻译：

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使用 Cu-Cu 热压粘合密封 MEMS 原子蒸气电池

MEMS 原子蒸气室在芯片级原子设备（例如时钟、陀螺仪或磁力计）中具有广泛的应用。这些电池通常通过硼硅酸盐与硅的阳极键合来密封，这是一种经过验证且可靠的方法，但也显示出特定的局限性，例如腔内固有的氧污染或对几种材料组合的限制。作为替代方案，我们报告了通过 Cu-Cu 热压键合密封电池的成功晶圆级制造。这种替代技术允许克服阳极键合的限制，同时允许使用新的各种其他材料。鉴于用于芯片级原子钟 (CSAC)，结合质量的表征以及光谱表征被提出。[2019-0151]