In this paper, a thin film based Thermoresistive Micro Calorimetric Flow (TMCF) sensor by using a $0.35~\mu \text{m}$ 2P4M CMOS MEMS technology is designed, fabricated and tested. The developed $1.6~\mu \text{m}$ thick thin film CMOS TMCF sensor shows a maximum normalized sensitivity of 103 mV/(m/s)/mW with respect to the input heating power and a wide dynamic flow range of 0 ~ 19.4 m/s. The high sensitivity and wide dynamic range achieved by our CMOS MEMS flow sensor enable its deployment as a promising sensing node for HVAC application in the smart energy-efficient building (EeB). Moreover, a new one-dimensional (1D) analytical sensor model that considers the three-dimensional (3D) heat loss via the end of the thin film is proposed. The new 1D model can successfully capture the thin film based TMCF sensor’s response, and its prediction results show a good agreement with the experimental study. Therefore, this new 1D model will be a useful design tool for the development of a high-performance TMCF sensor with a greatly reduced footprint.

中文翻译：

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采用 CMOS MEMS 技术的高灵敏度和宽动态范围热阻微量热流量传感器

在本文中，一种基于薄膜的热阻微量热流 (TMCF) 传感器通过使用 $0.35~\mu \text{m}$ 2P4M CMOS MEMS 技术经过设计、制造和测试。发达的 $1.6~\mu \text{m}$ 厚薄膜 CMOS TMCF 传感器相对于输入加热功率显示出 103 mV/(m/s)/mW 的最大归一化灵敏度和 0 ~ 19.4 m/s 的宽动态流量范围。我们的 CMOS MEMS 流量传感器实现了高灵敏度和宽动态范围，使其成为智能节能建筑 (EeB) 中暖通空调应用的有前途的传感节点。此外，还提出了一种新的一维 (1D) 分析传感器模型，该模型考虑了薄膜末端的三维 (3D) 热损失。新的一维模型可以成功捕获基于薄膜的 TMCF 传感器的响应，其预测结果与实验研究具有良好的一致性。因此，这种新的一维模型将成为一种有用的设计工具，可用于开发占地面积大大减少的高性能 TMCF 传感器。