Abstract Polymer composites with high thermal conductivity have promising applications for the thermal management of modern electronic devices. Here, a novel strategy is proposed to enhance the thermal conductivity of epoxy composites by employing a hybrid graphene and boron nitride nanoparticle (GBN). In the GBN, boron nitride nanosheets (BNNSs) tightly adsorb onto the surface of graphene via π-π interactions, and act as bridges for conveying phonons as well as barriers for electrons transporting between adjacent graphene particles. The thermal conductivity and dielectric properties of composites containing GBN are then systematically investigated. The thermal conductivity is significantly enhanced (~140%) in GBN/epoxy composites containing only 5 wt% of GBN. High electrical resistivity (3.05 × 1012 Ω·cm) and low dielectric loss (tanδ

中文翻译：

---

通过引入石墨烯@氮化硼纳米片混合纳米粒子提高环氧树脂复合材料的导热性

摘要 具有高导热性的聚合物复合材料在现代电子设备的热管理中具有广阔的应用前景。在这里，提出了一种通过使用混合石墨烯和氮化硼纳米颗粒 (GBN) 来提高环氧树脂复合材料热导率的新策略。在 GBN 中，氮化硼纳米片 (BNNSs) 通过 π-π 相互作用紧密吸附在石墨烯表面，充当传输声子的桥梁以及相邻石墨烯颗粒之间电子传输的屏障。然后系统地研究了含有 GBN 的复合材料的热导率和介电性能。仅含有 5 wt% GBN 的 GBN/环氧树脂复合材料的热导率显着提高（~140%）。高电阻率 (3.05 × 1012 Ω·cm) 和低介电损耗 (tanδ