Abstract The analysis of SCE (specific cutting energy) is vital for determining the machining efficiency. Conventionally, the machining forces are used to determine SCE, which is quantified as the energy that is consumed to remove unit volume of material. To correlate the micro-mechanics of material deformation and small-scale material removal in machining, in this research paper, the SCE has been modelled with consideration of shearing mechanism. While developing the model, small scale material indentation and deformation phenomena have been correlated with complex tool-work interaction behaviour in micro machining. The experiment was conducted for validation of the model for different light-weight materials i.e. Al alloy and Cu alloy. The investigation was done through the analysis of cutting forces and the visual examination of microchip morphology. It was found that the nonlinear increase and sharp fall of specific shearing energy (UShe) occur owing to the variations of the material removal mechanism. This is especially valid for lower values of UCT (undeformed chip thickness).

中文翻译：

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比切削能及其在剪切主导精密微切削中的作用研究

摘要 SCE（比切削能量）的分析对于确定加工效率至关重要。通常，加工力用于确定 SCE，SCE 被量化为去除单位体积材料所消耗的能量。为了将材料变形的微观力学与加工中的小尺度材料去除相关联，在本研究论文中，SCE 已在考虑剪切机制的情况下进行建模。在开发模型时，小尺度材料压痕和变形现象与微加工中复杂的工具-工件相互作用行为相关。该实验是为了验证不同轻质材料（即铝合金和铜合金）的模型。研究是通过切削力分析和微芯片形态的目视检查来完成的。发现由于材料去除机制的变化，比剪切能（UShe）的非线性增加和急剧下降发生。这对于较低的 UCT（未变形切屑厚度）值尤其有效。